>AMD is using a kind of modular processor architecture which, as I understand it, makes the chips easier / less expensive to fab than an Intel design of compara

>AMD is using a kind of modular processor architecture which, as I understand it, makes the chips easier / less expensive to fab than an Intel design of comparable size You pretty much got it. It all basically comes down to the yield you get on waffer. The larger the die, the less you can fit on a waffer, the more chance there is a defect in the die. Using a few smaller dies is a smart way to get high yields out of your waffers.