And in my experience, it's usually not the CPU itself that has an issue, but some flaky solder joint, or the BGA under a chip, just like in the Xbox 360 'red ri

And in my experience, it's usually not the CPU itself that has an issue, but some flaky solder joint, or the BGA under a chip, just like in the Xbox 360 'red ring of death' era. With mass-manufactured products, if you got a device from a batch that was a few percentage points out of tolerance, the thermal stress can cause issues more quickly than if you didn't introduce the thermal stress.