3 ms·
True, I worded it a bit wrong. But the metal case is a huge improvement over the plastic die package on the Pi 3 B and earlier—a heat sink helps a little but yo
by geerlingguy 7y ago
True, I worded it a bit wrong. But the metal case is a huge improvement over the plastic die package on the Pi 3 B and earlier—a heat sink helps a little but you don't yet _need_ one if you use a fan, since the metal is much better at dispersing the heat.
- kees99 7y agoIndeed - there is enough aluminum/copper in the SoC's metal lid and PCB's inner (ground/power) layers, that the whole thing is effectively a 2-3 square-inch heat-sink. Eben himself has been talking about this technique around the time RPi3+ was released. And your point here is completely understandable too - there is a kinda-heatsink there already. Just add a fan, and we're good. My point is - seeing a large black hole where SoC goes (color corresponding to +20-ish degrees C by the chart) is utterly confusing, since SoC is the hottest point actually.