As far as I know (and anyone in the field please correct me), ASML focuses on photolithography equipment. Which leaves where you put it, how you feed it, and ho

As far as I know (and anyone in the field please correct me), ASML focuses on photolithography equipment. Which leaves where you put it, how you feed it, and how you validate the output. In a sense, it's kind of like a nuclear plant -- you can't not consider the site and physical structure as part of the operation. I wouldn't be surprised if those parts are the secret sauce for a lot of cutting edge fabs. How do you isolate your space while moving materials about? What do you clean, when, and how? We gave industrial engineers crap at my school, but for semiconductor fabrication the holistic approach seems necessary. (Would love to hear more details from someone)