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I agree with you, I don't see how Intel will cool a 3D chip unless the bottom package is extremely simple. Even then, it looks like that design would be more e
by CoolGuySteve 7y ago
I agree with you, I don't see how Intel will cool a 3D chip unless the bottom package is extremely simple. Even then, it looks like that design would be more expensive than the multilayer mini-board + ball grid array AMD explained in their presentation.
In both this case and their delays in getting to 10nm due to wanting larger dies, it really feels like Intel's management is letting better be the enemy of good whereas AMD is making smarter choices about where to compromise.
By the time Intel releases their awesome 10nm 3D chiplet stack, AMD will likely have moved onto 5nm compute chiplets with a 7nm IO chiplet. It's not clear to me how Intel will catch up in the next 5 years or so.
- ct520 7y agoUh - Intel is releasing Foveros this year. Assume its going to be in a surface type of device. Little big core for x86. AMD will not be on 5nm. You seem confused about the status of the industry.. Point being you were wrong in the statements you have been making. 5nm will not be out by the time Foveros is introduced. I did not state Foveros is a competitor to a 128 thread epyc processor..
- CoolGuySteve 7y agoYa cool, a small mobile chip. Meanwhile AMD is releasing a 128 thread EPYC later this year. No yield problems here. What's your point again?
- ct520 7y agosee above