The power dissipation problem of current chips (performance is almost always power/thermal limited) is correlated with 2D structures Graphene thermal pads have

The power dissipation problem of current chips (performance is almost always power/thermal limited) is correlated with 2D structures Graphene thermal pads have really phenomenal lateral thermal conductivity. 3D computer chips could be constructed of alternating silicon and thermal graphene layers, perhaps conducting to a central core, which could be made of copper or could even contain water or a heat pipe. https://www.youtube.com/watch?v=YpphKzmDiJM https://www.youtube.com/watch?v=YpphKzmDiJM