I was gonna chime in on 360's and saw your comment. The best solution that didn't involve replacing solder was a reflow combined with case mods to add screws t

I was gonna chime in on 360's and saw your comment. The best solution that didn't involve replacing solder was a reflow combined with case mods to add screws that better stabilized the board directly around the problem chips which limited board warping so the inevitable solder melting heat cycles did not result in connection failures upon cooling, IME. There was rumblings that lead-free solder was a requirement for 'toy' classification but I can't confirm.