3 ms·
The above is correct. Do not do it. In addition, even with hot air soldering equipment, "reflowing" the chips on the board is not a reliable method of fixing th
by jwr 8y ago
The above is correct. Do not do it. In addition, even with hot air soldering equipment, "reflowing" the chips on the board is not a reliable method of fixing the problem. Even if you temporarily improve things, symptoms will likely re-appear.
If the problem is indeed in the connections below BGA chips, the proper solution is reballing, which involves desoldering and lifting the entire chip off the board, cleaning the entire area, then reballing, placing and soldering it in again. This is a non-trivial operation that requires specialized equipment.
- tcmb 8y ago> the proper solution is reballing, which involves [...] reballing Sounds like that will take forever.
- areoform 8y agoFor an ordinary individual, perhaps, but not for a domain expert. There are people out there who do this for a living and are quite good at this. Just like we advise others to leverage our expertise in software. We should leverage theirs. Specialization, ftw! edit: oops didn't see the recursion joke :(
- kgermino 8y ago(It's a recursion joke)
- russdill 8y agoAt the very least get some no clean flux under there.