> The GPUs are manufactured normally, but this technology is basically "just" a wafer-scale interconnect. I wonder if this is something like Intel's Foveros 3D

> The GPUs are manufactured normally, but this technology is basically "just" a wafer-scale interconnect. I wonder if this is something like Intel's Foveros 3D chip stacking, where the wafer is treated more like a "PCB" (with the traces and such for signals/power) to the CPU chips bonded on top? Basically, a "PCB" made from silicon, where the components mounted on it are also bare CPU dies?