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Whats the hold up with Gallium-Arsenid (instead of silicon)? The PN junction threshold is 0.3V (instead of 0.7V for silicon). This would disipate less heat tha
by smallstepforman 8y ago
Whats the hold up with Gallium-Arsenid (instead of silicon)? The PN junction threshold is 0.3V (instead of 0.7V for silicon). This would disipate less heat than silican based IC’s. Anyone know the technical reasons why GaLliumArsenid isn’t feasable yet?
- ryacko 8y agoLikely the typical material sciences reasons, having to do with heat, strength, expansion, etc.
- Scipio_Afri 8y agoFrom my experience, its really brittle.
- BostonEnginerd 8y agoWe’ve been working with GaAs for a long time. You likely have a fair bit of it in your phone. A few things prevent its use for advanced CMOS - base material quality is inferior to Si, it’s not available in 12” substrates, and the cost is high. You will likely see material integration of III-V material systems into Si, rather than using standalone GaAs for logic.
- deepnotderp 8y ago1. As we move to lower nodes, high carrier mobility materials such as GaAs actually perform worse than silicon due to increased source/drain direct tunneling. See: https://ieeexplore.ieee.org/document/7479214 https://ieeexplore.ieee.org/document/7479214 2. Most III-V materials have excellent electron mobility, making for great n-type transistors, but tend to have poor hole mobility which means bad p-type transistors. Germanium has high hole mobility, and it is already used in very small quantities to boost performance (see "germanium stressors") 3. Most III-Vs have no native oxide, nowadays at 28nm onwards due to the use of high-k dielectrics. However: Until recently, the growth of oxides on III-V materials without defects such as fermi level pinning was a Hard Problem.
- BostonEnginerd 8y agoThat’s a great reference!