Some alternatives are neuromorphic, heterogeneous computing and advanced packaging. Neuromorphic relies on neural networks, and one of the interesting things th

Some alternatives are neuromorphic, heterogeneous computing and advanced packaging. Neuromorphic relies on neural networks, and one of the interesting things there is lower accuracy computing to speed things up because you have a whole network of sensors to provide context and collective accuracy. Heterogeneous relies on different types of processors and memories scattered around one chip, which could include GPUs, APUs or even embedded FPGAs. Advanced packaging uses different chips packaged together and connected through bridges, interposers or in the case of monolithic 3D, TSVs between different metal layers. (Here's another link on the same site: https://semiengineering.com/big-changes-for-mainstream-chip-architectures https://semiengineering.com/big-changes-for-mainstream-chip-...) These are definitely major shifts, not marketing. The difficulty in continuing Moore's Law/Dennard scaling at 7nm and below makes it imperative to use alternatives. Instead of 50% improvements in power/performance at each new node, it's now 20% max, and probably significantly lower in some cases.