4 ms·
You vastly overestimate the forces required. Pumping water, let alone a less viscous organic fluid at a few mLs per minute through nominally 100micron pipe is f
by thereisnospork 8y ago
You vastly overestimate the forces required. Pumping water, let alone a less viscous organic fluid at a few mLs per minute through nominally 100micron pipe is fairly routine. You wouldn't even need 100psi to move a few mL/tube: plenty to absorb the heat output from a fraction of a processor layer.
- AstralStorm 8y agoFew mL/min is not enough cooling, that's the point. Way not enough to make a dent. Vapour phase is used in GPU interface already and is comparable to solid copper but lighter, why do you think merging a heatsink with the CPU will work when Intel has trouble even soldering the devices and leaves thick silicone layer on top? We're talking about something to remove many watts. This means huge capillary volume to compensate for low flow. Which means a lot of heatpipe surface soldered somehow to IHS. You'd have more success with solid copper layer which is sort of done where possible. (It's often not due to inductance.)
- thereisnospork 8y agomath: 200W output per CPU 'layer' on a 17x17mm* die = 17 x 127micron tubes flowing 25mL/min each at 160psi (easily reducible with moderately larger capillaries) totals 425mL/min. 425mL/min of water starting at 30C and ending at 75C would absorb 45C * 425mL/min 4.16J/C = 79,560 J/minutes or 1,300 watts - about 600% of requisite cooling capacity. nominal threadripper #'s http://www.waters.com/webassets/other/lp/prep_calc/Tubingandsplitters/Tubingandsplitters.htm?locale=en_US http://www.waters.com/webassets/other/lp/prep_calc/Tubingand...