I'd also wonder at the thermal properties and with a gap of 35nm, these would make chips large again. However, I suspect they would need to do vertical placeme

I'd also wonder at the thermal properties and with a gap of 35nm, these would make chips large again. However, I suspect they would need to do vertical placement to allow the gap to be large enough without stepping back in silicon real estate. However, the question then becomes more important about the thermal properties of such an approach.