I agree. Doing this now for 5G "mesh" based BTLE devices which I hope will drop dramatically in price. Working out low-cost PMIC, crystal and passive component

I agree. Doing this now for 5G "mesh" based BTLE devices which I hope will drop dramatically in price. Working out low-cost PMIC, crystal and passive component compatibilities for US based chipsets is a bit of a regulatory issue, but the "clones" iterate so fast I expect them to have complete designs available by mid-2019 and hope to make the money on the software / data.