You play to the strengths of the part and the interests of the target market. However the strategy to go with gluing smaller dies together also better fits the

You play to the strengths of the part and the interests of the target market. However the strategy to go with gluing smaller dies together also better fits the (long known) pragmatics of manufacturing processes. This allows AMD to hit lower price points and while getting better margins. It also coincides with Intel being hit with "The Thermocline of Truth" where they were too optimistic about overcoming the challenges of larger die sizes. "The Thermocline of Truth" http://brucefwebster.com/2008/04/15/the-wetware-crisis-the-themocline-of-truth/ http://brucefwebster.com/2008/04/15/the-wetware-crisis-the-t...