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Interesting design. The 70mm^2 die is more similar to an embedded chip so I guess that explains how AMD was able to hit 7nm so much earlier than Intel. But re
by CoolGuySteve 8y ago
Interesting design. The 70mm^2 die is more similar to an embedded chip so I guess that explains how AMD was able to hit 7nm so much earlier than Intel.
But reading between the lines, AMD is only showing benchmarks for extremely parallel loads much like they did with ThreadRipper 2. Between the physically separate processing cores and the nature of the marketing benchmarks, I suspect workloads that have high IPC or extremely low latency requirements won't fare so well on this chip.
The weirdest part is to think what Apple might come up with if they were to take the A12X design and connect it on a die like AMD has done here. It would probably make for a pretty interesting Mac Pro.
- ip26 8y agoYou play to the strengths of the part and the interests of the target market. People willing to pay the price premium for ThreadRipper are interested in throughput, not latency.
- stcredzero 8y agoYou play to the strengths of the part and the interests of the target market. However the strategy to go with gluing smaller dies together also better fits the (long known) pragmatics of manufacturing processes. This allows AMD to hit lower price points and while getting better margins. It also coincides with Intel being hit with "The Thermocline of Truth" where they were too optimistic about overcoming the challenges of larger die sizes. "The Thermocline of Truth" http://brucefwebster.com/2008/04/15/the-wetware-crisis-the-themocline-of-truth/ http://brucefwebster.com/2008/04/15/the-wetware-crisis-the-t...