3 ms·
Ask HN: Why not re-interpret Moore's law from MTr/mm2 to MTr/mm3?
- wmf 8y agoSo you're basically talking about 3D stacking or integration. This doesn't have much effect, because replacing a single die with a die stack is basically a wash; it's the same transistors on the same silicon area, just rearranged. (3D NAND and 3D XPoint are an exception to this.) And generally stacking is less area-efficient than a single die because TSVs are enormous. Stacking is more energy-efficient because it allows traces to be shorter (e.g. HBM2) and it's more space-efficient at the product level by reducing the amount of packaging.