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Is the die mask one of the biggest challenges for the 5/7 nm chips? I would of assumed it would of been the uniformity of the wafer process.
by syntaxing 8y ago
Is the die mask one of the biggest challenges for the 5/7 nm chips? I would of assumed it would of been the uniformity of the wafer process.
- monocasa 8y agoFor EUV, yeah. That shit's tricky. The wiki page on EUV is uncharacteristically excellent. https://en.wikipedia.org/wiki/Extreme_ultraviolet_lithography https://en.wikipedia.org/wiki/Extreme_ultraviolet_lithograph...
- pas 8y ago> Since the optics already absorbs 96% of the EUV light, [...] WTF!? Why? Is there any hope for better optics?
- baybal2 8y agoMirrors on EUV machines are already the type that exceeds reflectivity of all mirrors ever produced. That's why you have to build fabs around a multi-megawatt laser source. The only known hope going forward are photonic crystal mirrors
- fermienrico 8y agoBut, why does 96% of the energy gets absorbed?
- dgacmu 8y agoEach mirror absorbs about 30% of the EUV incident upon it (and the mask counts as a mirror). With about 9 total mirrors on the path, you're down to 0.7^9 ~= 4% of the initial light left.
- baybal2 8y agoBecause everything absorbs EUV light. Every element out there has has bandgap wide enough for EUV