3 ms·
I would note that thinning and encapsulation of bare die allows typical thicknesses of <200um. Now, if you need an smt package and a (F)PCB then everything blow
by kurthr 8y ago
I would note that thinning and encapsulation of bare die allows typical thicknesses of <200um. Now, if you need an smt package and a (F)PCB then everything blows up to mm total thickness. Note also that typical minimum dicing width is 6-700um and your micros layout could be re-done to be a more toothpick 3x0.66x0.2 size. Still, gotta get power in and signals out, but conformal parylene will cover ACF or wirebonds.
- baybal2 8y agoYou can put a lot of tsvs across the border of IC and grind up to them, hoping that the wire will bond to at least one of them. And if you do bonding by hand, you can bond right to the metal if the oxide below is thick enough.