A major redesign. TSMC will have different IP available, particularly IO and RAM cells. Also different packaging options: they may not support the same die and/

A major redesign. TSMC will have different IP available, particularly IO and RAM cells. Also different packaging options: they may not support the same die and/or interposer sizes. The test methodology and tooling may also be very different to what they are used to working with. Switching fab is a huge deal, the time cost would be big. They can of course gobble up the financial costs no problem. However, it does assume TSMC would even have sufficient capacity for Intel.