With a monolithic die that lower bound is not linear though: the bigger the die, the higher a chance of defects and the rarer the parts that don't need to have

With a monolithic die that lower bound is not linear though: the bigger the die, the higher a chance of defects and the rarer the parts that don't need to have sections fused off. With a modular design the lower bound is, indeed, linear, allowing AMD to severely undercut Intel.