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The heat can be tackled in part by pumping water through holes in the CPU. I believe it was IBM that came up with this. Can't tell if it's feasible or not.
by tormeh 8y ago
The heat can be tackled in part by pumping water through holes in the CPU. I believe it was IBM that came up with this. Can't tell if it's feasible or not.
- blackflame7000 8y agoI was thinking by either creating a temperature differential on a copper conductor to chill the cube from within or that the motherboard/walls would provide cooling from the pin side.
- deepnotderp 8y agoYes but microfluidics limits how thin each die can be.
- agumonkey 8y agoWhat about stacked heat vias ?
- deepnotderp 8y agoWhat are those? Do you mean something like thermal "dummy" vias?
- agumonkey 8y agoyeah, something imprinted in all layers so you could evacuate heat