High mounting pressure will squeeze out excess thermal paste which greatly narrows the difference between the most and least conductive compounds when both surf

High mounting pressure will squeeze out excess thermal paste which greatly narrows the difference between the most and least conductive compounds when both surfaces are fairly smooth and even in while in contact. https://www.overclockers.com/heatsink-mounting-pressure-vs-performance/ https://www.overclockers.com/heatsink-mounting-pressure-vs-p...