4 ms·
Which is ironically also how you fixed it. I'll never forget the "magic" of wrapping my Xbox 360 in several towels and overheat for 30 minutes to supposedly res
by Puer 8y ago
Which is ironically also how you fixed it. I'll never forget the "magic" of wrapping my Xbox 360 in several towels and overheat for 30 minutes to supposedly resolder it back together. It worked for another 6 months after that until it completely and finally died.
- lloeki 8y agoThe problem was more precisely that thermal variations combined with the way the heatsink was attached and pushing on the middle of the CPU repeatedly warped the board due to thermal expansion, causing the balls to unseat. Heating the thing would help reseat the BGA thanks to thermal expansion but would certainly not reflow soldering (not enough heat). The proper fix was to try to reseat the BGA by whatever means and change the way the heatsink was attached so that pressure on the BGA/board was even. I did that on two units and they survived for years after their first RRoD, and on a third unit right from the get go, and that one never suffered of any issue.