Heat sinks and pipes don't matter all that much since you can simply increase the area to achieve higher conduction. The bottleneck is getting it from small chi

Heat sinks and pipes don't matter all that much since you can simply increase the area to achieve higher conduction. The bottleneck is getting it from small chip hotspots to the heat spreader on top of the chip. So this would sit as a layer directly on top of the chip beneath the more conventional heat spreader.