> line up well enough for reflow. > If you used FR4 instead of acrylic or whatever, you might be able to leave the aligner stencil in place for reflow. That mi

> line up well enough for reflow. > If you used FR4 instead of acrylic or whatever, you might be able to leave the aligner stencil in place for reflow. That might let you do some of the smaller parts. When the solder wets it will 'suck' the part into place, the alignment of the part isn't particularly critical. If you are dealing with extremely small parts like 0402 or under caps, you can run into issues where the wetting of one side just before the other causing the cap to pop up on end, but that isn't an alignment issue and the stencil won't help. In a proper production line these parts would have what is basically glue holding the middle in place enough to avoid this. EDIT: If you're finding the parts aren't sucking into place, chance are you need to use more flux or check the solder formulation you're using against the PCB finish.