4 ms·
BGA is actually easier than leaded SMD parts. The tiny leads tend to bridge easily. With BGA you can be up to half the pitch off and it will center itself. I
by slededit 8y ago
BGA is actually easier than leaded SMD parts. The tiny leads tend to bridge easily. With BGA you can be up to half the pitch off and it will center itself. I actually only go for leadless and BGA now because anything else is more of a hassle.
It is a bit rude to assume I don't know what a BGA part is.
- jacquesm 8y agoThe tweezers bit is what triggered that. Handling a large BGA with tweezers is going to scratch the PCB if you're not ultra careful. Anyway, if you do this stuff often enough then I see no reason why you wouldn't get the proper tools, a rework station and an actual reflow oven or something with a PID controlled heating element would make your life so much easier. Working with bad tools would drive me nuts. The reason the larger BGA center themselves is as soon as the solder goes fluid there is a lot of accumulated surface tension trying to reduce the size of the bridge and that will center the part all by itself. For that to work properly though everything has to become fluid more or less at once and stay fluid until the part has shifted to the right position.
- slededit 8y agoThe tweezers are for the 0802 passives and nudging the FPGA itself. It takes forever but then so does programming the pick and place for a one-off. As for the reflow you can actually get more consistent results with the toaster oven - It just won't be able to handle the volume of actual production. Whatever you do just don't try going "semi-pro" and getting one of those IR ovens from China. Stick with the $40 walmart special. The toaster oven when heated slowly is much less likely to have hot and cold spots. Stenciling and placing parts take up a lot more time and are much more error prone.