tl;dr - Existing technology will be pushed to the limits first. There are lots of new technologies currently being researched, but it's not obvious which will t

tl;dr - Existing technology will be pushed to the limits first. There are lots of new technologies currently being researched, but it's not obvious which will take over. New ideas will "scale over the next 10 years", not over the next 5 years. Moore's law is not ending because of physical limits. It's slowing down because we don't know which option to pursue. We are currently at 10 nm [1]. After that is 7 nm (2018), then 5 nm (2020), then 3 nm. FinFETs will be used at 5 nm. Another technology might come at 3 nm, or later. 3D NAND memory is currently stacked at 48 layers. It will be increased to 96, 128, maybe even 256 layers. The challenge is to keep thin wafers flat when stacking them on top of each other. DRAM will be around for a while. There are new ideas such as MRAM and XPoint, but DRAM is faster and lasts longer. Personal addition: Existing technology will get us 2TB SDXC cards. After that we'll need a new industry standard for larger cards. [1] https://en.wikipedia.org/wiki/10_nanometer https://en.wikipedia.org/wiki/10_nanometer