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I think the main interesting thing here is that one can build bulk circuits .... many, 100s of, embedded layers deep as you build a 3D object .... the next step
by Taniwha 9y ago
I think the main interesting thing here is that one can build bulk circuits .... many, 100s of, embedded layers deep as you build a 3D object .... the next step is obviously an integrated pick&place that embeds components in something as it's printed ... and of course the step after is something with enough precision to lay down say 2u FETs ...
- jack_h 9y agoEmbedded components could definitely be a benefit. This sort of thing is already somewhat possible (e.g. PCB cavities) but has limitations. Another interesting possibility would be designing complex surfaces that components can attach to rather than the traditional top/bottom of a PCB. Again this is already somewhat possible with techniques like 3D-MIDs (molded interconnect devices). 3D printing would make this sort of thing far more feasible though as MIDs are inherently limited to traces on the surface, meaning you're limited to a single layer. Pick and place machines would need to get rather advanced for this to work as well. I know there are a few out there to handle MID orientations, solder paste extrusion, and laser soldering, but from what I've seen they're quite slow. Of course heat dissipation and electromagnetic effects could become interesting design challenges (or design patterns) if the geometries are complex enough.