the future after that is more dies on the chip. bigger chips with lower core counts that can run lots more instruction sets per cycle then for multicore put ma

the future after that is more dies on the chip. bigger chips with lower core counts that can run lots more instruction sets per cycle then for multicore put many dies on each chip. more yield too it's better, you can makes sure every die is operational at the very least, and if not desolder and replace that die.