5 ms·
You can't compare numbers across fabs anymore. Die size is basically marketing at this point.
by Armisael16 9y ago
You can't compare numbers across fabs anymore. Die size is basically marketing at this point.
- mtgx 9y agoThey seem to have beaten Intel in adopting EUV lithography at least. IBM's 5nm gate-all-around FET (GAAFET) process, which GloFlo should be able have ready for production in 2020, also looks very interesting. https://www-03.ibm.com/press/us/en/pressrelease/52531.wss https://www-03.ibm.com/press/us/en/pressrelease/52531.wss
- deepnotderp 9y agoThey're only using EUV for a, couple of layers. Intel is using SADP (or SAQP), that should be able to hold its own.
- sbierwagen 9y agoDie size Feature size?
- Armisael16 9y agoYep. My bad.