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Europe funds ARM-based server research
- hga 16y ago"[...] the research is targeting the Cortex-A9 MPcore processor to create "good enough" processing nodes along with 3-D DRAM structures and packaging to provide high bandwidth access to server memory." 3-D packaging looks a lot more practical when you start out with a low heat dissipation CPU. And they only have to stack 4GB on the processor die since ARM is still 32 bit only (well, I suppose they could do something like the x84 PAE but that doesn't really seem to fit with the concept). I still wonder how much room there remains in server space for 4 GB address spaces. The SeaMicro system lots of people are excited about currently has a 2 GB limit, but I have to wonder if they'll stick to that when they can use a power (heat) competitive chip and chipset from AMD with ECC and a > 4 GB memory capacity.