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These are the first Intel HEDT chips to not have a soldered heat-spreader. Instead they are using thermal paste between the chip and the heat-spreader. This is
by en4bz 9y ago
These are the first Intel HEDT chips to not have a soldered heat-spreader. Instead they are using thermal paste between the chip and the heat-spreader. This is generally accepted to be bad practice since they use cheap paste and it's dependent on how the paste was spread on each chip. I also believe that Intel has basically said water cooling is a must for these chips.
- dis-sys 9y agowill be interesting to see whether they still have room for overclocking or Intel has already done so. ;)
- dom0 9y agoWell anandtech already found that water cooling is simply insufficient to cool these for overclocking. You need an active thermal sink AKA a compressor cooler, and then you're still limited by the TIM-gunk; heat-spreader at 25 °C, core at 100 °C. I suppose for the next generation Intel will announce that liquid nitrogen is basically required.
- TomMarius 9y agoUsage of liquid nitrogen would put us just a few steps away from achieving superconductivity... Thanks Intel, I guess?