>We should expect mobile electronics to be sealed watertight at the factory. That does seem to be the final destination as things become more and more tightly

>We should expect mobile electronics to be sealed watertight at the factory. That does seem to be the final destination as things become more and more tightly integrated. "System on module" seems to be where we are headed. After all, you don't crack open your CPU to repair that bad L1 cache. It would be nice to compromise on some sane boundaries though. Perhaps screen, "processing unit", and battery. I'd give up some thinness to mix and match those components to suit my use cases.