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Are the black areas in this picture [0] residue or destruction from removing the heatspreder? What about the large areas that are not as dark? Is that residue f
by tutanchamun 10y ago
Are the black areas in this picture [0] residue or destruction from removing the heatspreder? What about the large areas that are not as dark? Is that residue from the solder/thermalpaste?
I'm especially curious because the die shot from AMD's Ryzen has smaller but kind of similiar looking areas. [1] But there they look too uniform to be damage.
[0] https://s.zeptobars.com/baikal-Si-HD.jpg https://s.zeptobars.com/baikal-Si-HD.jpg
[1] http://i.imgur.com/le2atYb.jpg http://i.imgur.com/le2atYb.jpg
- trsohmers 10y agoIt's a flip chip design, so the heatspreader and thermal paste does not touch the part that you are seeing in these images. The areas that I think you are referring to (the big "blob" areas) are computer place and routed standard cells (primarily transistors) that the PNR tool brute forces efficient placement under certain constraints. While it does not produce the most pretty or clean design, it does a good enough job in optimizing for speed and area for most designs.
- tutanchamun 10y agoYes, that are the areas I was reffering to. Thank you for the explanation.