I'm assuming this might also mean they can leverage their legacy fabs to a greater degree for non-critical components in competitive spaces? That seems like a h

I'm assuming this might also mean they can leverage their legacy fabs to a greater degree for non-critical components in competitive spaces? That seems like a huge advantage. It sounds like a move from "Do we assume the next node will be ready for our most important chip in X years?" to "What parts of chips is the next node currently ready for?" Fabbing smaller dies on lower-yield, leading edge processes would also be nice. Curious what the trade-offs will look like in terms of power/thermal vs a monolithic die design.