>> make it viable again to split the dies of the IGP and the CPU allowing Intel have SKUs with different IGP configuration Also, it allows Intel to increase th

>> make it viable again to split the dies of the IGP and the CPU allowing Intel have SKUs with different IGP configuration Also, it allows Intel to increase the rate of innovation - for example by specifying how each silicon die(memory, interconnect, rf?, acceleration, etc) connects to the EMIB, and letting internal and maybe external groups work independently and maybe compete on better modules. Shame this would be wasted on someone as close as Intel though.