4 ms·
Uh, well I guess...? But generally speaking IC fabbing doesn't happen in the "couple hundreds". If you really want that, you'd be looking at MPW (multi project
by throwawayish 10y ago
Uh, well I guess...? But generally speaking IC fabbing doesn't happen in the "couple hundreds". If you really want that, you'd be looking at MPW (multi project wafers), were a bunch of designs are slapped on a single mask to spread yield and reduce per-party costs. (It pretty much works like PCB group manufacturing - a bunch of designs is slapped together 'til the maximum size of the fab, and then that is produced a couple times, e-tested, cut and bad pieces discarded. Everyone gets a couple copies of their design.)
Today it's a bit better, since eg. GF can (in theory) offer recent nodes (eg 22 nm and smaller), which wasn't something you could get ten years ago (back then that'd be 65 nm - most low-volume and custom stuff has been iirc 130 or 180 nm).