3 ms·
The hurdle is heat - we can do something like this in mobile SoCs, which commonly place DRAM on top of the CPU (package-on-package). But for a TDP > 10 watts, t
by neilmovva 10y ago
The hurdle is heat - we can do something like this in mobile SoCs, which commonly place DRAM on top of the CPU (package-on-package). But for a TDP > 10 watts, the memory layer effectively insulates the main die from whatever thermal management is used, making it unworkable. Unfortunately, this problem stands to get worse as transistors shrink, since power density will keep going up.