Here's some info on solder columns for everyone else: http://www.topline.tv/CCGA_column.html http://www.topline.tv/CCGA_column.html While reading that myself,

Here's some info on solder columns for everyone else: http://www.topline.tv/CCGA_column.html http://www.topline.tv/CCGA_column.html While reading that myself, I also happened upon solder springs, which seem like an even niftier idea: http://www.topline.tv/CCGA_MCS_Micro_Coil_Spring.html http://www.topline.tv/CCGA_MCS_Micro_Coil_Spring.html Apparently that company makes the solder springs available also has RoHS safe versions of them, perhaps this could solve the cracking problem? Another company has a paper out which says that you can use their solder column attach process with existing BGA chips: http://www.solderability.com/newsletter082005/ConvertingBGAComponentstoCGA.pdf http://www.solderability.com/newsletter082005/ConvertingBGAC... Could some manufacturer (while unlikely, curious if it's possible) choose to use solder springs with this SSD's BGA package to make it more mechanically reliable when installed?