> I don't understand the real value in this. They take a bunch of BGA parts + passives and put the dies in a bigger BGA that approaches the same PCB area? > (.

> I don't understand the real value in this. They take a bunch of BGA parts + passives and put the dies in a bigger BGA that approaches the same PCB area? > (...) > Only thing it seems to do is enable quicker prototyping by avoiding having to get things like the DDR memory traces correct. And a shorter BOM. My guess is that this sort of bundling may help in terms of driver support, as it provides a very specific bundle of hardware components and features. Perhaps someone knowledgeable on the subject can chime in on the subject.