> the hardware problem of integrating both chips on the same die Mostly a non-issue. Multi-chip packages have been around for decades. Intel has been putting D

> the hardware problem of integrating both chips on the same die Mostly a non-issue. Multi-chip packages have been around for decades. Intel has been putting DRAM chips onto their CPU packages (for their Iris Pro graphics chips) for a few generations now; Core i CPUs also have on-chip PCIE controllers together with their QPI inter-cpu interface, if for some reason the latter can't be made to work with FPGAs.