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There's two techniques that I find work very well for SMD ICs for hand assembled boards: - hot air rework wand. I got mine from China for $100. It works awesom
by tonyarkles 11y ago
There's two techniques that I find work very well for SMD ICs for hand assembled boards:
- hot air rework wand. I got mine from China for $100. It works awesome both for removing parts and for melting paste.
- flood & wick. You start by tacking down two corners of the chip, and then drag the tip with some solder along the full edge. You'll probably get some bridging between pins. Sometimes, when the moon is aligned just right, you just get a perfect solder. For the times when you don't, the next step is to take a bit of fresh wick and clean it up.
Between these two tools (cheap Chinese reflow wand $100, and a nice Hakko iron $100), I've probably hand-assembled 75-100 prototypes and I don't recall ever destroying one. My next trick is going to be trying to do some BGA parts... new experiences!
- userbinator 11y agoHot air is definitely the right way to do it for SMD/BGA, and I find it much easier than through-hole because you don't have to solder each pin separately -- just aim the gun at the part and wait for the solder to melt. The surface tension means the part will actually self-align into place over the pads if you get it close enough. BGA is not that much more difficult; look online for videos of the phone repair shops in China which can swap BGA chips in literally minutes.