Yes indeed, the HBM memory in the latest AMD GPUs is stacked. This press release is extremely frustrating, by the way, because it's full of fluff and hype. Thr

Yes indeed, the HBM memory in the latest AMD GPUs is stacked. This press release is extremely frustrating, by the way, because it's full of fluff and hype. Through-silicon vias have been in discussion for a long time (and, as you said, are even in production already). Apparently, this team uses different materials (carbon nano-tubes). This is potentially interesting, but I'm very sceptical. Certainly, any claim of "factors of thousands" is just ridiculous. Wires are a significant part of delays on chips, but having shorter interconnects isn't going to speed up the switching time of transistors, which would become a bottleneck again.