4 ms·
Nothing too exciting. Having RAM closer to the die is nice, but it's still DRAM. Incremental progress rather than a quantum leap, as usual. I see some advantage
by mng2 11y ago
Nothing too exciting. Having RAM closer to the die is nice, but it's still DRAM. Incremental progress rather than a quantum leap, as usual. I see some advantage in customers not needing to lay out high-speed memory on their PCB, which can require multiple design cycles to get right.
They're achieving this using Intel's EMIB silicon bridge technology, but that was apparently already available to them as a fab customer.
- FullyFunctional 11y agoYou might want to read up on HMC; this enables 10X the DRAM bandwidth to the FPGA. Since DRAM bandwidth is a bottleneck for many real applications, this is a big deal. That said, the PR contains nothing about capacity, latency, nor price, so it's near-pointless.