3 ms·

I think the big story here is the number of chips they can stack. From the article you pointed out to they were using 8 stacked dies. "The later capacity is a

I think the big story here is the number of chips they can stack. From the article you pointed out to they were using 8 stacked dies. "The later capacity is accomplished using 8 stacked and thinned (< 75 um) NAND chips in a 1.2 mm package" The samsung one has 48 layers per the article. So that's a 6x improvement.

wmf 11y ago
You're kind of mixing up a few things. 3D NAND (aka V-NAND) has many (48) layers per die, and then they also stack those dies. But they made each cell much larger, so going from 1 layer to 48 layers is only a net density increase of 2x.
- mcshicks 11y ago
  You are absolutely correct. Thanks.